Job Description

Job Overview

MediaTek is seeking a talented and experienced technical leader with expertise in Packaging Architect, specifically 2.5D/3D/3.5D and STCO. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, thermomechanical, product engineering, Test, and system team. The goal is to develop advanced packaging architecture and to guide development of innovative packaging solutions for automotive, datacenter/HPC, and computing applications.

The ideal candidate will play a key role in identifying the optimal package architecture and key packaging technologies, establishing 3rd party relationships, communicating with partners and addressing challenges in areas such as 2.5D/3D/3.5D and System technology optimization with advanced Si nodes. including but not limited to CoWoS-S/R/L, EMIB/EMIB-T, SoIC, HBM, FCBGA, and HBPOP. The candidate should demonstrate ownership, high standards, strategic thinking, and customer obsession.

Role and Responsibilities:

• Identify the optimal package architecture by balancing electrical, thermal, and mechanical performance, meeting project’s timeline.
• Working closely with internal and external partners on silicon-disaggregation and other chiplet strategies for advanced packages, including emerging-memory chiplet integration
• Perform a trade-off analysis across silicon layout, die-to-die connectivity options, and package design/technology, evaluating their impact on key product metrics, including performance, cost, manufacturability, power efficiency, and form factor.
• Identifying critical elements for packaging roadmap, Partner with supply chain engineering experts to define packaging technology and material requirements for substrate fabrication, assembly, and raw material vendors.
• Stay informed about emerging packaging architectures by engaging with the product team and customers in the data center and high-end compute segments.
• Continuously monitor the competitive landscape in packaging technologies and solutions.

Required Skills and Experience:

• Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS-S/R/L, EMIB/EMIB-T, SoIC, CoW, WoW, POP, etc.
• Extensive experience in characterization and design of 2D, 2.5D, & 3D flip-chip & wafer-scale packaging solutions; experience in the areas of power-signal integrity, thermal-mechanical & system engineering domains.
• Proven track record of bringing up successful packages/ products with high power and high bandwidth applications from inception to product introduction.
• Extensive experience with high-speed interfaces, including SERDES, PCIe, die-to-die (D2D) interconnects and CPO & CPC, with a strong understanding of their impact on packaging technology choices, such as substrate selection, interconnect architecture, signal integrity, CPO & CPC integration, and thermal considerations.
• Experience in HBM on package integration, DDR integration, and working knowledge of various memory types.
• Experience in various EDA & CAD tools.
• Excellent communication skills
• About 10-15% international travel required

Salary range: $180,000 - $256,000

Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Paid time off (PTO), Parental leave, 401K and more.

MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.

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